XCZU19EG-2FFVD1760E _ System On Chip (SoC)_Embedded_Integrated Circuits (ICs)_

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XCZU19EG-2FFVD1760E

XCZU19EG-2FFVD1760E

Part Number	XCZU19EG-2FFVD1760E
Manufacturer	Xilinx (AMD)
Other Part Numbers	XCZU19EG-2FFVD1760E-ND
Description	IC SOC CORTEX-A53 1760FCBGA
Detailed Description	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells 533MHz, 600MHz, 1.3GHz 1760-FCBGA (42.5x42.5)
Manufacturer Standard Lead Time	16 weeks
Datasheet	Datasheet

Product Attributes

Category		Integrated Circuits (ICs) Embedded System On Chip (SoC)
Manufacturer		Xilinx (AMD)
Series		Zynq® UltraScale+™ MPSoC EG
Packaging		Tray
Part Status		Active
Package / Case		1760-BBGA, FCBGA
Speed		533MHz, 600MHz, 1.3GHz
RAM Size		256KB
Number of I/O		308
Operating Temperature		0°C ~ 100°C (TJ)
Core Processor		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes		Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals		DMA, WDT
Supplier Device Package		1760-FCBGA (42.5x42.5)
Architecture		MCU, FPGA

Documents & Media

RESOURCE TYPE		LINK
Datasheets		Xilinx REACH211 Cert

Environmental & Export Classifications

ATTRIBUTE		DESCRIPTION
ECCN		5A002A4 XIL
HTSUS		8542.39.0001
Moisture Sensitivity Level (MSL)		4 (72 Hours)
REACH Status		REACH Unaffected
RoHS Status		ROHS3 Compliant

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