XCVM1402-2MLIVSVD1760 _ System On Chip (SoC)_Embedded_Integrated Circuits (ICs)_

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XCVM1402-2MLIVSVD1760

XCVM1402-2MLIVSVD1760

Part Number	XCVM1402-2MLIVSVD1760
Manufacturer	Xilinx (AMD)
Other Part Numbers	122-XCVM1402-2MLIVSVD1760-ND 122-XCVM1402-2MLIVSVD1760
Description	IC VERSALPRIME ACAP FPGA 1760BGA
Detailed Description	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ System On Chip (SOC) IC Versal™ Prime Versal™ Prime FPGA, 1.2M Logic Cells 600MHz, 1.4GHz 1760-FCBGA (40x40)
Manufacturer Standard Lead Time	26 weeks

Product Attributes

Category		Integrated Circuits (ICs) Embedded System On Chip (SoC)
Manufacturer		Xilinx (AMD)
Series		Versal™ Prime
Packaging		Tray
Part Status		Active
Package / Case		1760-BFBGA, FCBGA
Speed		600MHz, 1.4GHz
RAM Size		256KB
Operating Temperature		-40°C ~ 100°C (TJ)
Core Processor		Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes		Versal™ Prime FPGA, 1.2M Logic Cells
Connectivity		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals		DDR, DMA, PCIe
Supplier Device Package		1760-FCBGA (40x40)
Architecture		MPU, FPGA

Documents & Media

RESOURCE TYPE		LINK

Environmental & Export Classifications

ATTRIBUTE		DESCRIPTION
Moisture Sensitivity Level (MSL)		4 (72 Hours)
RoHS Status		ROHS3 Compliant

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