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TS391LT10

Part Number
TS391LT10
Manufacturer Chip Quik, Inc.
Other Part Numbers
TS391LT10-ND
Description THERMALLY STABLE SOLDER PASTE NO
Detailed Description Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Syringe, 1.23 oz (35g), 10cc
Manufacturer Standard Lead Time 3 weeks
Datasheet Datasheet

Product Attributes

Category
Manufacturer Chip Quik, Inc.
Series
Packaging
Bulk
Part Status Active
Composition Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type Solder Paste
Melting Point 281°F (138°C)
Form Syringe, 1.23 oz (35g), 10cc
Mesh Type 4
Process Lead Free
Flux Type No-Clean
Storage/Refrigeration Temperature 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start Date of Manufacture
Shelf Life 12 Months

Documents & Media

RESOURCE TYPE LINK
Datasheets TS391LT10
Datasheets TS391LT10 SDS

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
ECCN EAR99
HTSUS 3810.10.0000
Moisture Sensitivity Level (MSL) Not Applicable
REACH Status REACH Unaffected
RoHS Status ROHS3 Compliant

In Stock: 19

Can ship immediately.
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