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TC4-5G

Part Number
TC4-5G
Manufacturer Chip Quik, Inc.
Other Part Numbers
315-TC4-5G-ND
315-TC4-5G
Description HEAT SINK THERMAL COMPOUND - DEE
Detailed Description Thermal Thermal Compound, Liquid Metal 5 gram Syringe
Manufacturer Standard Lead Time 4 weeks
Datasheet Datasheet

Product Attributes

Category
Manufacturer Chip Quik, Inc.
Series
Packaging
Bulk
Part Status Active
Color Silver
Size / Dimension 5 gram Syringe
Type Thermal Compound, Liquid Metal
Thermal Conductivity 79.00 W/m-K
Storage/Refrigeration Temperature 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start Date of Manufacture
Shelf Life 60 Months
Usable Temperature Range -40°F ~ 302°F (-40°C ~ 150°C)

Documents & Media

RESOURCE TYPE LINK
Datasheets TC4-5G
HTML Datasheet TC4-5G Datasheet

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
ECCN EAR99
HTSUS 3810.10.0000
Moisture Sensitivity Level (MSL) Not Applicable
REACH Status REACH Unaffected
RoHS Status ROHS3 Compliant

In Stock: 34

Can ship immediately.
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