Part Number |
TC4-10G
|
---|---|
Manufacturer | Chip Quik, Inc. |
Other Part Numbers |
315-TC4-10G-ND
315-TC4-10G
|
Description | HEAT SINK THERMAL COMPOUND - DEE |
Detailed Description | Thermal Thermal Compound, Liquid Metal 10 gram Syringe |
Manufacturer Standard Lead Time | 4 weeks |
Datasheet | Datasheet |
Category | ||
---|---|---|
Manufacturer | Chip Quik, Inc. | |
Series |
CHIPQUIK®
|
|
Packaging |
Bulk
|
|
Part Status | Active | |
Color | Silver | |
Size / Dimension | 10 gram Syringe | |
Type | Thermal Compound, Liquid Metal | |
Thermal Conductivity | 79.00 W/m-K | |
Storage/Refrigeration Temperature | 68°F ~ 77°F (20°C ~ 25°C) | |
Shelf Life Start | Date of Manufacture | |
Shelf Life | 60 Months | |
Usable Temperature Range | -40°F ~ 302°F (-40°C ~ 150°C) |
RESOURCE TYPE | LINK | |
---|---|---|
Datasheets | TC4-10G |
ATTRIBUTE | DESCRIPTION | |
---|---|---|
ECCN | EAR99 | |
HTSUS | 3810.10.0000 | |
Moisture Sensitivity Level (MSL) | Not Applicable | |
REACH Status | REACH Unaffected | |
RoHS Status | ROHS3 Compliant |
QUANTITY | UNIT PRICE | EXT PRICE |
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