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TC1-200G

Part Number
TC1-200G
Manufacturer Chip Quik, Inc.
Other Part Numbers
TC1-200G-ND
Description HEAT SINK COMPOUND - HIGH DENSIT
Detailed Description Thermal Silicone Compound 200 gram Jar
Manufacturer Standard Lead Time 4 weeks

Product Attributes

Category
Manufacturer Chip Quik, Inc.
Series
Packaging
Bulk
Part Status Active
Color White
Size / Dimension 200 gram Jar
Type Silicone Compound
Thermal Conductivity 0.67W/m-K
Storage/Refrigeration Temperature 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life 60 Months

Documents & Media

RESOURCE TYPE LINK
Datasheets TC1-200G
MSDS Material Safety Datasheet Thermal Paste SDS
HTML Datasheet TC1-200G Datasheet

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
ECCN EAR99
HTSUS 3403.99.0000
Moisture Sensitivity Level (MSL) Not Applicable
REACH Status REACH Unaffected
RoHS Status ROHS3 Compliant

In Stock: 13

Can ship immediately.
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Detailed pricing is currently unavailable.
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