Part Number |
TC1-200G
|
---|---|
Manufacturer | Chip Quik, Inc. |
Other Part Numbers |
TC1-200G-ND
|
Description | HEAT SINK COMPOUND - HIGH DENSIT |
Detailed Description | Thermal Silicone Compound 200 gram Jar |
Manufacturer Standard Lead Time | 4 weeks |
Category | ||
---|---|---|
Manufacturer | Chip Quik, Inc. | |
Series | ||
Packaging |
Bulk
|
|
Part Status | Active | |
Color | White | |
Size / Dimension | 200 gram Jar | |
Type | Silicone Compound | |
Thermal Conductivity | 0.67W/m-K | |
Storage/Refrigeration Temperature | 37°F ~ 77°F (3°C ~ 25°C) | |
Shelf Life | 60 Months |
RESOURCE TYPE | LINK | |
---|---|---|
Datasheets | TC1-200G | |
MSDS Material Safety Datasheet | Thermal Paste SDS | |
HTML Datasheet | TC1-200G Datasheet |
ATTRIBUTE | DESCRIPTION | |
---|---|---|
ECCN | EAR99 | |
HTSUS | 3403.99.0000 | |
Moisture Sensitivity Level (MSL) | Not Applicable | |
REACH Status | REACH Unaffected | |
RoHS Status | ROHS3 Compliant |
QUANTITY | UNIT PRICE | EXT PRICE |
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