SMDSWLF.006 1G - Chip Quik, Inc.

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SMDSWLF.006 1G

SMDSWLF.006 1G

Part Number	SMDSWLF.006 1G
Manufacturer	Chip Quik, Inc.
Other Part Numbers	315-SMDSWLF.0061G-ND 315-SMDSWLF.0061G
Description	SOLDER WIRE SN96.5/AG3/CU0.5
Detailed Description	Lead Free No-Clean, Water Soluble Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) Spool, 0.035 oz (1g)
Manufacturer Standard Lead Time	4 weeks
Datasheet	Datasheet

Product Attributes

Category		Soldering, Desoldering, Rework Products Solder
Manufacturer		Chip Quik, Inc.
Series
Packaging		Bulk
Part Status		Active
Diameter		0.006" (0.15mm)
Composition		Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type		Wire Solder
Melting Point		423 ~ 428°F (217 ~ 220°C)
Form		Spool, 0.035 oz (1g)
Process		Lead Free
Flux Type		No-Clean, Water Soluble

Documents & Media

RESOURCE TYPE		LINK
Datasheets		SMDSWLF.006 1G

Environmental & Export Classifications

ATTRIBUTE		DESCRIPTION
ECCN		EAR99
HTSUS		8311.30.6000
Moisture Sensitivity Level (MSL)		1 (Unlimited)
REACH Status		REACH Unaffected
RoHS Status		ROHS3 Compliant

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