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SMDLTLFP15T4

Part Number
SMDLTLFP15T4
Manufacturer Chip Quik, Inc.
Other Part Numbers
SMDLTLFP15T4-ND
Description TWO PART MIX SOLDER PASTE
Detailed Description Lead Free No-Clean Solder Paste, Two Part Mix Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 0.53 oz (15g)
Manufacturer Standard Lead Time 4 weeks

Product Attributes

Category
Manufacturer Chip Quik, Inc.
Series
Packaging
Bulk
Part Status Active
Composition Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type Solder Paste, Two Part Mix
Melting Point 281°F (138°C)
Form Jar, 0.53 oz (15g)
Mesh Type 4
Process Lead Free
Flux Type No-Clean
Storage/Refrigeration Temperature 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start Date of Manufacture
Shelf Life 24 Months

Documents & Media

RESOURCE TYPE LINK
Datasheets SMDLTLFP15T4
Datasheets SMD291SNL, SMD4300SNL & SMDLTLFP MSDS

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
ECCN EAR99
HTSUS 3810.10.0000
Moisture Sensitivity Level (MSL) Not Applicable
REACH Status REACH Unaffected
RoHS Status ROHS3 Compliant

In Stock: 15

Can ship immediately.
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