Part Number |
SMDLTLFP15T4
|
---|---|
Manufacturer | Chip Quik, Inc. |
Other Part Numbers |
SMDLTLFP15T4-ND
|
Description | TWO PART MIX SOLDER PASTE |
Detailed Description | Lead Free No-Clean Solder Paste, Two Part Mix Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 0.53 oz (15g) |
Manufacturer Standard Lead Time | 4 weeks |
Category | ||
---|---|---|
Manufacturer | Chip Quik, Inc. | |
Series | ||
Packaging |
Bulk
|
|
Part Status | Active | |
Composition | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | |
Type | Solder Paste, Two Part Mix | |
Melting Point | 281°F (138°C) | |
Form | Jar, 0.53 oz (15g) | |
Mesh Type | 4 | |
Process | Lead Free | |
Flux Type | No-Clean | |
Storage/Refrigeration Temperature | 37°F ~ 77°F (3°C ~ 25°C) | |
Shelf Life Start | Date of Manufacture | |
Shelf Life | 24 Months |
RESOURCE TYPE | LINK | |
---|---|---|
Datasheets | SMDLTLFP15T4 | |
Datasheets | SMD291SNL, SMD4300SNL & SMDLTLFP MSDS |
ATTRIBUTE | DESCRIPTION | |
---|---|---|
ECCN | EAR99 | |
HTSUS | 3810.10.0000 | |
Moisture Sensitivity Level (MSL) | Not Applicable | |
REACH Status | REACH Unaffected | |
RoHS Status | ROHS3 Compliant |
QUANTITY | UNIT PRICE | EXT PRICE |
---|---|---|
{{ numberFormat(price.break_quantity) }} | {{ priceFormat(price.unit_price) }} | {{ priceFormat(price.break_quantity * price.unit_price) }} |