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JET551AX30T5

Part Number
JET551AX30T5
Manufacturer Chip Quik, Inc.
Other Part Numbers
315-JET551AX30T5-ND
315-JET551AX30T5
Description JET PRINTING SOLDER PASTE SN63/P
Detailed Description Leaded No-Clean Solder Paste Sn63Pb37 (63/37) Syringe, 3.53 oz (100g)
Manufacturer Standard Lead Time 4 weeks
Datasheet Datasheet

Product Attributes

Category
Manufacturer Chip Quik, Inc.
Series
CHIPQUIK®
Packaging
Bulk
Part Status Active
Composition Sn63Pb37 (63/37)
Type Solder Paste
Melting Point 361°F (183°C)
Form Syringe, 3.53 oz (100g)
Process Leaded
Flux Type No-Clean
Shelf Life Start Date of Manufacture
Shelf Life 12 Months

Documents & Media

RESOURCE TYPE LINK
Datasheets JET551AX30T5

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Affected
RoHS Status ROHS3 Compliant

Available To Order

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