DILB18P-223TLF

Part Number	DILB18P-223TLF
Manufacturer	Storage & Server IO (Amphenol Communications Solutions)
Other Part Numbers	609-5427-ND 609-5427 2266-DILB18P-223TLF DILB18P-223TLF-ND
Description	CONN IC DIP SOCKET 18POS TINLEAD
Detailed Description	18 (2 x 9) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Tin-Lead Through Hole
Manufacturer Standard Lead Time	11 weeks
Datasheet	Datasheet

Category		Connectors, Interconnects Sockets for ICs, Transistors IC Sockets
Manufacturer		Storage & Server IO (Amphenol Communications Solutions)
Series		DILB
Packaging		Tube
Part Status		Active
Features		Open Frame
Mounting Type		Through Hole
Type		DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature		-55°C ~ 125°C
Number of Positions or Pins (Grid)		18 (2 x 9)
Termination		Solder
Material Flammability Rating		UL94 V-0
Housing Material		Polyamide (PA), Nylon
Pitch - Mating		0.100" (2.54mm)
Contact Finish - Mating		Tin-Lead
Contact Finish Thickness - Mating		100.0µin (2.54µm)
Contact Material - Mating		Copper Alloy
Pitch - Post		0.100" (2.54mm)
Contact Finish - Post		Tin-Lead
Contact Finish Thickness - Post		100.0µin (2.54µm)
Contact Material - Post		Copper Alloy
Termination Post Length		0.124" (3.15mm)
Contact Resistance		30mOhm
Current Rating (Amps)		1 A

RESOURCE TYPE		LINK
Datasheets		DILB18P-223TLF

ATTRIBUTE		DESCRIPTION
ECCN		EAR99
HTSUS		8536.69.4040
Moisture Sensitivity Level (MSL)		1 (Unlimited)
REACH Status		REACH Affected
RoHS Status		RoHS Compliant

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