| Part Number |
XC7Z010-1CLG225C
|
|---|---|
| Manufacturer | Xilinx (AMD) |
| Other Part Numbers |
122-1855-ND
122-1855
|
| Description | IC SOC CORTEX-A9 667MHZ 225BGA |
| Detailed Description | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Artix™-7 FPGA, 28K Logic Cells 667MHz 225-CSPBGA (13x13) |
| Manufacturer Standard Lead Time | 16 weeks |
| Category | ||
|---|---|---|
| Manufacturer | Xilinx (AMD) | |
| Series |
Zynq®-7000
|
|
| Packaging |
Tray
|
|
| Part Status | Active | |
| Package / Case | 225-LFBGA, CSPBGA | |
| Speed | 667MHz | |
| RAM Size | 256KB | |
| Number of I/O | 86 | |
| Operating Temperature | 0°C ~ 85°C (TJ) | |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | |
| Primary Attributes | Artix™-7 FPGA, 28K Logic Cells | |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |
| Peripherals | DMA | |
| Supplier Device Package | 225-CSPBGA (13x13) | |
| Architecture | MCU, FPGA |
| RESOURCE TYPE | LINK |
|---|
| ATTRIBUTE | DESCRIPTION | |
|---|---|---|
| ECCN | 3A991A2 | |
| HTSUS | 8542.39.0001 | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| REACH Status | REACH Unaffected | |
| RoHS Status | ROHS3 Compliant |
| QUANTITY | UNIT PRICE | EXT PRICE |
|---|---|---|
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